Process Equipment for Semiconductors
UV cleaning Systems
Etching System
Laser System
Deposition System
Sealing Equipment
Metrology System
Testing Equipment
Bond Pull Tester
Wafer Scriber & Cleaving System
ETS –Laser Diode Reliability & Burn-In Test System
Pyramid Engineering
- Cold Welding
- Laser Welding
- Nitrogen Glovebox
- Resistance Welding
- Seam Sealer
- Hermetic Welding
- Film Stress
- Film Adhesion
- 3DIC TSV Process Control
- Thin wafer metrology
- Electrical Characterization
- Low Coherence Interferometry
- Laser Scanning
- Raman Spectroscopy
AccuThermo AW410 RTP
- AccuThermo AW610
- AccuThermo AW810
- AccuThermo AW820
- AccuThermo AW810V
- AccuThermo AW820V
RF/DC Sputtering System
Non-contact Thickness/Roughness Measurement
Cetek Bond Pull Testers
- HAWK 8000 S
- HAWK 8000M
- HAWK 8200WS
- HAWK8200WS-RVK
Other Capabilities –Jigs & Fixtures
KOVIS, KOREA
KOVIS, KOREA
Other Capabilities –Jigs & Fixtures
KOVIS, KOREA
KOVIS, KOREA
DTX Scribe and Break
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