Process Equipment for Semiconductors
UV cleaning Systems
Etching System
Laser System
Deposition System
Sealing Equipment
Metrology System
Testing Equipment
Bond Pull Tester
Die Bonders
Wire Bonders
Wafer Scriber & Cleaving System
ETS –Laser Diode Reliability & Burn-In Test System
MRSI Die Bonders
- H FAMILY
- MRSI M1
- MRSI M3
- MRSI 705
- MRSI 175 AG
Pyramid Engineering
- Cold Welding
- Laser Welding
- Nitrogen Glovebox
- Resistance Welding
- Seam Sealer
- Hermetic Welding
- Film Stress
- Film Adhesion
- 3DIC TSV Process Control
- Thin wafer metrology
- Electrical Characterization
- Low Coherence Interferometry
- Laser Scanning
- Raman Spectroscopy
- Anode PECVD
- Cathode PECVD
- Atomic layer deposition
- RIE
- DRIE
- ICP RIE
- Plasma Cleaner
- UV Ozone Cleaner
AccuThermo AW410 RTP
- AccuThermo AW610
- AccuThermo AW810
- AccuThermo AW820
- AccuThermo AW810V
- AccuThermo AW820V
RF/DC Sputtering System
Non-contact Thickness/Roughness Measurement
Semiautomatic Wire Bonder with 3 motorized axes (WB-300-U)
- Wedge/ Ball Bonding with gold or aluminium wire
- 17 μm - 50 μm
- Motorized Deep Access Bondhead Z-axis 50 mm
- Accuracy 1,0 μm
- Bond arm length 165 mm
- Motorizied X-Y-table
- Fine table motion 50 x 50 mm
- Accuracy 1,0 μm
Cetek Bond Pull Testers
- HAWK 8000 S
- HAWK 8000M
- HAWK 8200WS
- HAWK8200WS-RVK
Other Capabilities –Jigs & Fixtures
KOVIS, KOREA
KOVIS, KOREA
Other Capabilities –Jigs & Fixtures
KOVIS, KOREA
KOVIS, KOREA
DTX Scribe and Break
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