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Product Representation
Process Equipment for Semiconductors
Plasma Systems
UV cleaning Systems
Etching System
Laser System
Deposition System
Sealing Equipment
Metrology System
Testing Equipment
Bond Pull Tester
Die Bonders
Wire Bonders
Wafer Scriber & Cleaving System
ETS –Laser Diode Reliability & Burn-In Test System
MRSI Die Bonders
H FAMILY
MRSI M1
MRSI M3
MRSI 705
MRSI 175 AG
Pyramid Engineering
Cold Welding
Laser Welding
Nitrogen Glovebox
Resistance Welding
Seam Sealer
Hermetic Welding
Film Stress
Film Adhesion
3DIC TSV Process Control
Thin wafer metrology
Electrical Characterization
Low Coherence Interferometry
Laser Scanning
Raman Spectroscopy
Anode PECVD
Cathode PECVD
Atomic layer deposition
RIE
DRIE
ICP RIE
Plasma Cleaner
UV Ozone Cleaner
AccuThermo AW410 RTP
AccuThermo AW610
AccuThermo AW810
AccuThermo AW820
AccuThermo AW810V
AccuThermo AW820V
RF/DC Sputtering System
Non-contact Thickness/Roughness Measurement
Asher/Descum
AW410
AW610
AW810/810V
AW820/820V
Plasma RIE
AW2001R
AW610
AW902e
Plasma Cleaning
Plasma Etching
Plasma Asher
PCB Etching
High Volume Etching System
Polymerization system
Atmospheric plasma system
IBOND 5000 Wire Bonder
Manual wedge bonder
Manual ball bonder
Semiautomatic Dual Bonder
Cetek Bond Pull Testers
HAWK 8000 S
HAWK 8000M
HAWK 8200WS
HAWK8200WS-RVK
Other Capabilities –Jigs & Fixtures
KOVIS, KOREA
KOVIS, KOREA
Other Capabilities –Jigs & Fixtures
KOVIS, KOREA
KOVIS, KOREA
DTX Scribe and Break
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