Process Equipment for Semiconductors

Plasma Systems

UV cleaning Systems

Etching System

Laser System

Deposition System

Sealing Equipment

Metrology System

Testing Equipment

Bond Pull Tester

Die Bonders

Wire Bonders

Wafer Scriber & Cleaving System

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ETS –Laser Diode Reliability & Burn-In Test System

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MRSI Die Bonders

  • H FAMILY
  • MRSI M1
  • MRSI M3
  • MRSI 705
  • MRSI 175 AG
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Pyramid Engineering

  • Cold Welding
  • Laser Welding
  • Nitrogen Glovebox
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  • Resistance Welding
  • Seam Sealer
  • Hermetic Welding
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  • Film Stress
  • Film Adhesion
  • 3DIC TSV Process Control
  • Thin wafer metrology
  • Electrical Characterization
  • Low Coherence Interferometry
  • Laser Scanning
  • Raman Spectroscopy
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  • Anode PECVD
  • Cathode PECVD
  • Atomic layer deposition
  • RIE
  • DRIE
  • ICP RIE
  • Plasma Cleaner
  • UV Ozone Cleaner
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AccuThermo AW410 RTP

  • AccuThermo AW610
  • AccuThermo AW810
  • AccuThermo AW820
  • AccuThermo AW810V
  • AccuThermo AW820V
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RF/DC Sputtering System

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Non-contact Thickness/Roughness Measurement

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Asher/Descum

  • AW410
  • AW610
  • AW810/810V
  • AW820/820V
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Plasma RIE

  • AW2001R
  • AW610
  • AW902e
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  • Plasma Cleaning
  • Plasma Etching
  • Plasma Asher
  • PCB Etching
  • High Volume Etching System
  • Polymerization system
  • Atmospheric plasma system
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IBOND 5000 Wire Bonder

  • Manual wedge bonder
  • Manual ball bonder
  • Semiautomatic Dual Bonder
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Cetek Bond Pull Testers

  • HAWK 8000 S
  • HAWK 8000M
  • HAWK 8200WS
  • HAWK8200WS-RVK

Other Capabilities –Jigs & Fixtures

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KOVIS, KOREA

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KOVIS, KOREA

Other Capabilities –Jigs & Fixtures

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KOVIS, KOREA

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KOVIS, KOREA

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DTX Scribe and Break

Our OEM Across the Globe

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