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Microelectronic Services - MES

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Wire bonding

  • Au (0.7-2mil)
  • Al (0.7,1, 2, 8, 10, 15, 20)
  • Au Ribbon (5 mil, 10 mil and 20 mil)
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Protective coating

  • Thick Film Pastes
  • Conductor: Au, Ag, PtAg, PdAg, PtPdAg,
  • Resistor, Dielectric, Overglaze
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Ribbon Bonding

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Ball-Wedge Wire Bonding

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Wedge-Ball Ribbon Bump

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Aluminium Bonding

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Copper Wire Bonding