Hot plate soldering
- Temperature range 50 – 350 Degree Celsius
Microelectronic Services - MES
Coil attachment
- Solder attach
- Lead frame attach
Hermetic sealing
- Resistance welding by parallel gap bonder
Wire bonding
- Au (0.7-2mil)
- Al (0.7,1, 2, 8, 10, 15, 20)
- Au Ribbon (5 mil, 10 mil and 20 mil)
Protective coating
- Thick Film Pastes
- Conductor: Au, Ag, PtAg, PdAg, PtPdAg,
- Resistor, Dielectric, Overglaze
Die Attachment
- Conductive epoxy attach
- Non conductive epoxy attach
Ribbon Bonding
Ball-Wedge Wire Bonding
Wedge-Ball Ribbon Bump
Aluminium Bonding
Copper Wire Bonding
MASK ALIGNER
LASER WRITER
SPIN COATER
WET BENCHING
DIE BONDER
WIRE BONDER
